LG Energy Solution Hosts ‘Battery Innovation Contest (BIC) 2025’ to Foster Breakthrough Battery Technologies
LG Energy Solution has announced its launch of the ‘Battery Innovation Contest (BIC) 2025’ to identify and support the next
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OKI Develops Printed Circuit Board Technology That Achieves 55 Times Better Heat Dissipation
OKI Develops Printed Circuit Board Technology with Stepped Copper Coin Insertion to Achieve 55 Times Better Heat Dissipation in Outer
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Meet Willow Google’s new state-of-the-art quantum chip
Willow has state-of-the-art performance across a number of metrics, enabling two major achievements. Errors are one of the greatest challenges
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Broadcom Delivers Industry’s First 3.5D F2F Technology for AI XPUs
Broadcom Inc has announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP™) platform technology, enabling consumer AI customers
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World first carbon-14 diamond battery made in UK
The world’s first carbon-14 diamond has been produced with the potential to provide power for thousands of years. Scientists and
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Hikvision achieves TÜV Rheinland Green Product Mark as first in LED display industry
Hangzhou Hikvision Digital Technology Co., Ltd. (“Hikvision”) announced that 16 of its LED display products received the Green Product Mark
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LG Innotek Becomes Industry’s First to Use AI to Prevent Input of Defective Raw Materials in Production
Today, LG Innotek (CEO Moon Hyuksoo) announced the development and application of the industry’s first “Artificial Intelligence (AI)-based inspection system for incoming raw
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Sony Semiconductor Solutions to Release the Industry’s First CMOS Image Sensor for Automotive Cameras That Can Simultaneously Process and Output RAW and YUV Images
Sony Semiconductor Solutions Corporation (SSS) has announced the upcoming release of the ISX038 CMOS image sensor for automotive cameras, the
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New support for semiconductor firms to grow, powering growth in £10 billion UK industry
UK semiconductor firms producing vital technology from phone screens to surgical lasers are being backed in their efforts to scale
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NewPhotonics Introduces NPG102 Transmitter-on-Chip for DSP-based Optical Modules Serving 1.6 Tbps AI-era Data Center Interconnect
NewPhotonics Ltd., a leader in advanced integrated photonics technologies has introduced its NPG102 PIC transmitter on chip (TOC) at 1.6Tbps
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