– NEO Semiconductor, a leading innovator in advanced AI and memory technologies, today announced the launch of NEO.AI, its next-generation AI memory platform designed to solve the two most significant memory bottlenecks limiting future artificial intelligence systems: on-chip memory (AI cache) and HBM capacity.
Read More– Montage Technology today announced the industry’s first trial production of its CXL® 3.2 Memory eXpander Controller (MXC) chip, designed to address escalating demands for memory expansion and resource pooling in AI, cloud computing, and data center environments.
Read More– Abracon, a leading global manufacturer of frequency control, timing, power, magnetics, RF, antenna, and connectivity solutions, today announced a new franchised distribution agreement with WT Microelectronics (TWSE: 3036), a leading global electronic components distributor.
Read More– Apple has announced a new multiyear commitment with Broadcom to design and produce custom silicon components and cutting-edge wireless connectivity technologies for a wide range of Apple products.
Read More-Hikvision announced that its DeepinView network camera series (iDS-2CD7x) has successfully obtained the EUCC (The European Cybersecurity Scheme on Common Criteria) certification.
Read More– Samsung Electronics, the world leader in advanced memory technology today announced that, for the first time in the industry, it has developed the industry’s fastest Universal Flash Storage (UFS) 5.0 solution, which will help enable seamless and highly efficient AI services on future mobile devices.
Read More– Amazon has introduced the next-generation Proteus at its Delivering the Future event in London. The new technology builds on the original autonomous robot and expands what’s possible in scope, capability, and how it can assist employees with their daily tasks.
Read More– Broadcom Inc a global technology leader that designs, develops, and supplies semiconductor and infrastructure software solutions, has announced the expansion of its Wi-Fi 8 portfolio with a new trio of highly integrated systems-on-chip (SoC) devices: BCM6772, BCM6774, and BCM6776.
Read More– The UK government is considering tougher measures against criminals exploiting gadgets designed to hack doorbells and vehicle tracking systems.
Read More– New terrestrial timing signal will ease reliance on satellite systems for digital infrastructure, like mobile phone networks and online banking.
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