Making 978 MHz spectrum available for drones in the UK
Ofcom has published a joint statement with the Civil Aviation Authority (CAA) on the use of 978 MHz spectrum for safety devices on drones.
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Microsoft’s new Majorana 1 the world’s first quantum chip
Microsoft has introduced Majorana 1, the world’s first quantum chip powered by a new Topological Core architecture that it expects will realize quantum computers capable of solving meaningful, industrial-scale problems in years, not decades.
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LG is advancing its robotics capabilities by securing a majority stake in Bear Robotics
LG Electronics (LG) has taken a significant step in advancing its robotics capabilities by securing a majority stake in Bear Robotics, a prominent Silicon Valley-based startup specializing in AI-driven autonomous service robots.
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New R&D Facility in Arizona for Semiconductor Prototyping and Advanced Packaging
The Semiconductor Industry Association (SIA) has this week released the following statement from SIA President and CEO John Neuffer commending
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Top secret UK lab develops atomic clock using quantum technology
Military personnel will use groundbreaking quantum technology to conduct more secure and precise operations, thanks to a new high-tech atomic
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Samsung Electronics To Become Largest Shareholder in Rainbow Robotics Accelerating Future Robot Development
Samsung Electronics has announced that it will become the largest shareholder in Rainbow Robotics to accelerate future robot development such
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LG Energy Solution Hosts ‘Battery Innovation Contest (BIC) 2025’ to Foster Breakthrough Battery Technologies
LG Energy Solution has announced its launch of the ‘Battery Innovation Contest (BIC) 2025’ to identify and support the next
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OKI Develops Printed Circuit Board Technology That Achieves 55 Times Better Heat Dissipation
OKI Develops Printed Circuit Board Technology with Stepped Copper Coin Insertion to Achieve 55 Times Better Heat Dissipation in Outer
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Meet Willow Google’s new state-of-the-art quantum chip
Willow has state-of-the-art performance across a number of metrics, enabling two major achievements. Errors are one of the greatest challenges
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Broadcom Delivers Industry’s First 3.5D F2F Technology for AI XPUs
Broadcom Inc has announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP™) platform technology, enabling consumer AI customers
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